http://developer.intel.com/products/processor/core2xe/index.htm
The Intel Core2 is built using a technology called Micro-FCPGA (Flip Chip Pin Grid Array). In this architecture the die (small block of semiconducting material) faces downward on top of the CPU with the back of the die exposed. This is to allow the die greater contact with the heatsink.
Friday, 8 August 2008
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